| 化学沉铜工艺中背光失效分析及改善探讨 |
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| 引用本文： | 杨勇杰.化学沉铜工艺中背光失效分析及改善探讨[J].印制电路信息,2013(6):12-15. |
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| 作者姓名： | 杨勇杰 |
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| 作者单位： | 博敏电子股份有限公司,广东梅州514768 |
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| 摘 要： | 主要讲述化学沉铜工艺中背光失效问题，通过对一次沉铜背光不良原因的查找及分析，并给出相应的改善措施，达到有效改善此类异常引发的沉铜背光失效的目的。
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| 关 键 词： | 化学沉铜 背光不良 可靠性 失效 药液 |
Chemistry sink copper process backlight failure analysis and improvement discussion |
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| YANG Yong-jie.Chemistry sink copper process backlight failure analysis and improvement discussion[J].Printed Circuit Information,2013(6):12-15. |
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| Authors: | YANG Yong-jie |
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| Affiliation: | YANG Yong-jie |
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| Abstract: | This paper mainly talks about chemistry sink copper process backlight failure, through reason search and analysis to sink copper backlight defect, it gives the corresponding improvement measures to improve such anomaly caused problem. |
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| Keywords: | Chemistry Sink Copper Backlight Bad Reliability Failure Solution |
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