一种嵌入式印制电路板的设计及加工方法的探讨

介绍一种在铜基内嵌入PCB线路的一种新产品及其制造技术。将印制电路板嵌入铜基内，印制电路表面与铜基板表面在同一平面上，在贴片封装时可以让铜基与高散热的元器件进行直接接触，从而直接进行快速导热散热。从产品的设计及加工过程进行探讨，产品的设计、铜基的蚀刻深度精度、尺寸精度、压合等是产品品质的关键控制点。

The research of the design and processing method of embedded PCB

This article aims at introducing a new product and technology of embedding the PCB circuit in the copper base. By embedding the circuit in the copper base, so we can havelthe circuit and the copper surface in the same plane. The copper base and the high heat dissipation components touch directly when doing SMT, thus directly fasten the heat conduction. Based on the design and the process of the products, we analyzed and concluded that： the product design, the etching depth accuracy of the copper base, the dimension accuracy as well as the lamination are the key points of the quality.