| 高导热型铝基覆铜板研究 |
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| 引用本文： | 周文英,齐暑华,吴轲,王彩凤,寇静利.高导热型铝基覆铜板研究[J].材料科学与工艺,2009,17(3):360-363. |
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| 作者姓名： | 周文英 齐暑华 吴轲 王彩凤 寇静利 |
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| 作者单位： | 周文英,ZHOU Wen-ying(西安交通大学,电力设备电气绝缘国家重点实验室,西安,710049);齐暑华,吴轲,QI Shu-hua,WU Ke(西北工业大学,理学院,应用化学系,西安,710072);王彩凤,寇静利,WANG Cai-feng,KOU Jing-li(西安向阳航天材料股份有限公司,西安,710025) |
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| 摘 要： | 为研究一种高导热铝基覆铜板,以合成的双马改性环氧树脂为基体,最佳质量配比的氮化铝、氮化硅、氮化硼等混合粒子为导热填料制备了绝缘导热胶粘剂,并以此导热胶成功制备了高导热铝基覆铜板.分析了树脂配方设计,探讨了填料含量对绝缘层导热、耐高温、电绝缘及粘接强度的影响.研究表明,研制的基板热导率达1.38 W/(m.K),热阻0.65℃/W,体、表电阻率分别为3.2×1014Ω.cm及4.6×1013Ω,可长期在160℃下使用,剥离强度13 N/cm,与低导热基板相比具有良好的传热能力.
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| 关 键 词： | 铝基覆铜板 热导率 耐高温 介电强度 改性环氧 |
Highly thermal conductive copper-clad aluminum substrate |
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| ZHOU Wen-ying,QI Shu-hua,WU Ke,WANG Cai-feng,KOU Jing-li.Highly thermal conductive copper-clad aluminum substrate[J].Materials Science and Technology,2009,17(3):360-363. |
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| Authors: | ZHOU Wen-ying QI Shu-hua WU Ke WANG Cai-feng KOU Jing-li |
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| Affiliation: | ZHOU Wen-ying1,QI Shu-hua2,WU Ke2,WANG Cai-feng3,KOU Jing-li3 (1.State Key Laboratory of Electrical Insulating & Power Equipment,Xi'an Jiaotong University,Xi'an 710049,China,2.Dept.of Applied Chemistry,School of Science,Northwestern Polytechnical University,Xi'an 710072,3.Xi'an Sunward Aerospace Materials Co.,Xi'an,710025,China) |
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| Abstract: | A kind of insulating thermal conductive adhesive(ITCA) was prepared by using the bismaleimide-modified epoxy resin synthesized in our lab as the matrix,and the mixture of AlN,Si3N4 and BN particles at optimal mass ratio as the heat conductive filler.Then,a novel highly thermal conductive copper-clad aluminum substrate(TCCAS) was successfully developed based on the prepared ITCA,copper foil and aluminum substrate through hot press technology.Investigation on the formulation design and the effects of fillers ... |
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| Keywords: | copper-clad aluminum substrate thermal conductivity high temperature resistance dielectric strength modified epoxy |
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