20kt/a PA6前聚合工艺的优化

介绍了20kt/aPA6聚合装置前聚合器的结构及工艺特点;分析了生产中前聚合工艺存在的问题,提出了解决措施;验证了前聚合器结构的设计参数。指出生产中由于前聚合器底部出料温度波动大,波动值达±8.08℃,影响了PA6切片的可纺性。通过降低前聚合反应的压力及加热联苯炉的温度,调整前聚合器顶部冷凝器的排汽温度,前聚合器底部出料温度的波动值可控制在±2.5℃,有效提高了PA6切片的质量。

Optimization of 20 kt/a PA6 prepolymerization process

The structure and technology characteristics of prepolymerization reactor were introduced for a 20 kt/a PA6 polymerization plant.The problem existing in the prepolymerization process was analyzed and the corresponding countermeasures were put forward.The structural design parameter of prepolymerization reactor was verified.The fluctuation of discharging temperature at the bottom of prepolymerization reactor could approach to ±8.08℃,which affected the spinnability of PA6 chip.The fluctuation of discharging temperature can be controlled as ±2.5℃ by decreasing the prepolymerization pressure and biphenyl kettle temperature and adjusting the exhaust temperature of the condenser at the top of prepolymerization reactor,thus the quality of PA6 chip can be efficiently improved.