液态树脂基材料与铜基材料的界面润湿现象分析

采用静滴法观察了液态树脂基材料与铜基材料的界面润湿现象,测定了298～363 K温度范围内的接触角,计算了附着功.结果表明:接触角随时间呈下降趋势,基板表面粗糙度对接触角的影响较大,在表面粗糙度较小时,接触角随时间下降较快,平衡接触角较小;初始接触角和平衡接触角均随树脂基材料中环氧树脂含量的增加而降低;升高温度使接触角的变化速率加快,加入树脂后的液体的平衡接触角对温度更加敏感;附着功随着时间的延长逐渐增加,但随着温度的上升而减小.

Wettability Analysis of Liquid Epoxy Resin-based Materials with Copper Substrate

The wettability of liquid epoxy resin-based materials with copper substrate was observed at 298-363K using a sessile drop method. The contact angle was measured, and the adhesion work was calculated. The contact angle tends to decrease with time elapsing in single experiment. The influence of surface roughness of substrate on contact angle is significant. The contact angle rapidly decreases and the equilibrium contact angle is small as the surface roughness is small. Both the original contact angle and equilibrium contact angle tend to decrease with increasing epoxy resin content in a sample. The adhesion work tends to increase with time elapsing, and it decreases with increasing temperature.