复合导热橡胶研究进展

填充型导热橡胶以其高热导率、低压易变形、密封性好等优势广泛应用作热界面导热材料。本文综述了近年来填充型导热橡胶研究进展,介绍了金属,碳,氮化物,及氧化物等填充型复合橡胶当前研究现状,分析了填料类型、尺寸、表面改性及材料加工方法等因素对导热橡胶热导率影响,阐述了提高复合导热橡胶热导率的几种途径。最后提出目前该研究领域存在的一些主要问题,并展望了导热橡胶未来发展方向。

Progress in thermal conductive composite rubbers

Thermal conductive composite rubber plays an important role in the heat dissipation of microelectronic devices due to its high thermal conductivity, easy deformation at low pressure and good tightness. This paper reviews the progress in the thermal conductive rubber filled with various fillers such as metals, oxides, nitrides, carbides, etc, and investigates the dependence of the thermal conductivity of filled rubbers on the filler type and shape, size, surface modification, and processing methods. Moreover, the present paper discusses the ways to improve the thermal conduction of filler rubbers. Finally, the unsolved problems encountered in this field are presented, and the future development directions are proposed at the end of the paper