Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能

利用丝网印刷法在聚酰亚胺基板上制备了Bi_0.5Sb_1.5Te₃/环氧树脂柔性复合热电厚膜, 通过优化Bi_0.5Sb_1.5Te₃粉末含量提高了其电输运性能。复合厚膜在300 K时的最优功率因子达到1.12 mW·m ^-1·K ^-2, 较前期报道的数值提高了33%。抗弯测试表明复合厚膜的电阻在弯曲半径大于20 mm时基本不变, 在弯曲半径为20 mm, 弯曲次数小于3000次时, 仅有轻微增大, 说明其在柔性热电器件领域具有应用潜力。红外热成像技术显示, 在工作电流为0.01 A到0.05 A时, 复合厚膜热电臂两端可以形成4.2 ℃到7.8 ℃的温差, 表明了其在面内制冷领域应用的可能性。

Fabrication and Planar Cooling Performance of Flexible Bi0.5Sb1.5Te3/epoxy Composite Thermoelectric Films

Flexible Bi_0.5Sb_1.5Te₃/epoxy composite thermoelectric films were prepared on polyimide substrates by screen printing. Its electrical transport properties are enhanced by optimizing the content of Bi_0.5Sb_1.5Te₃ powder. The highest power factor of the optimized Bi_0.5Sb_1.5Te₃/epoxy films reached 1.12 mW·m ^-1·K ^-2at 300 K, increased by 33% as compared with previous value. The anti-bending test results show that resistance of the thick films remains unchanged when the bending radius is over 20 mm and slightly increases within 3000 bending cycles when the bending radius is 20 mm, implying that the as-prepared films have potential application in flexible TE devices. The flexible thermoelectric leg could establish a temperature difference from 4.2 ℃ to 7.8 ℃ under working current from 0.01 A to 0.05 A, showing potential application in planar cooling field.