| SiCp/Cu复合材料的显微组织和力学性能 |
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| 引用本文： | 王春华,关绍康,张锐.SiCp/Cu复合材料的显微组织和力学性能[J].机械工程材料,2007,31(9):48-50,54. |
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| 作者姓名： | 王春华 关绍康 张锐 |
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| 作者单位： | 1. 郑州大学材料科学与工程学院,河南郑州,450001;河南工业大学材料科学与工程学院,河南郑州,450007
2. 郑州大学材料科学与工程学院,河南郑州,450001 |
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| 基金项目： | 河南省杰出青年科学基金 |
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| 摘 要： | 采用非均相沉淀包裹法制得铜包SiC复合粉体,利用热压烧结工艺制备了含有体积分数为20%～65%SiC颗粒的SiCp/Cu复合材料.用X射线衍射仪、扫描电镜、能谱分析等测试方法对试样进行了成分和微观形貌分析.结果表明:包裹法制得的SiCp/Cu复合材料中基体铜形成连续的结构,SiC分散较均匀;随着SiC含量的增加,试样孔隙率提高,抗弯强度下降;而硬度则先增后降,并在SiC体积分数为35%时出现最大值;所有试样均表现为脆性断裂.
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| 关 键 词： | SiCp/Cu复合材料 包裹 热压烧结 SiCp 复合材料 显微组织 力学性能 Mechanical Properties Microstructure 脆性断裂 表现 最大值 硬度 抗弯强度 孔隙率 含量 均匀 结构 连续 基体 结果 形貌分析 微观 |
| 文章编号： | 1000-3738（2007）09-0048-03 |
| 修稿时间： | 2006-09-142007-01-26 |
Microstructure and Mechanical Properties of SiCp/Cu Composites |
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| WANG Chun-hua,GUAN Shao-kang,ZHANG Rui.Microstructure and Mechanical Properties of SiCp/Cu Composites[J].Materials For Mechanical Engineering,2007,31(9):48-50,54. |
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| Authors: | WANG Chun-hua GUAN Shao-kang ZHANG Rui |
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| Affiliation: | 1.Zhengzhou University, Zhengzhou 540001, China; 2. Henan University of Technology, Zhengzhou 540007, China |
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| Abstract: | Cu coated SiC composite powders were made by the heterogeneous precipitation coating method and the hot pressing process was used to prepare SiCp/Cu composites with 20%-65%SiC particles. The composition and microstructure of samples were characterized by X-ray diffraction, SEM with EDS. Continuous matrix copper is obtained in the composites with the SiC particles distributed uniformly. The porosity of the composites increase, but the flexural strength decrease with increasing fraction of SiCk. The composites with 35%SiCp show the highest hardness. All samples exhibit brittle fracture behavior. |
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| Keywords: | SiCp/Cu composite 0 coating hot pressing process |
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