Filler-induced failure mechanism in plastic-encapsulated microelectronic packages |
| |
Authors: | Seong-Min Lee |
| |
Affiliation: | (1) Department of Materials Science and Engineering, University of Incheon, 177, Dohwa-dong, Nam-gu, 402-749 Incheon, South Korea |
| |
Abstract: | Based on empirical data, the present work provides a model to prevent filler-induced reliability degradation in plastic-encapsulated
LOC (lead-on-chip) packages. According to the model, the maximum size of the silica fillers included in the plastic package
body should be smaller than one half of the inter-distance between the device and its overlying lead-frame. In particular,
it is shown in the model that the spherical silica particles, which are sometimes trapped in the space between the top surface
of the device and the bottom of the lead-frame during the encapsulating process, can induce huge compressive stress on a specific
site of the integrated circuit pattern due to the thermal shrinkage of the plastic package body. Further, the present model
suggests that tiny fillers squeezed beneath a large trapping filler might directly attack the brittle layer of the device
pattern because the compressive force from the large filler particle can develop into huge compressive stress due to the reduced
load-carrying area. |
| |
Keywords: | semiconductor plastic package filler thermal-cycling reliability |
本文献已被 SpringerLink 等数据库收录! |
|