A finite element model for the analysis of buckling driven delaminations of thin films on rigid substrates |
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Authors: | F Gruttmann V D Pham |
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Affiliation: | 1.Institut für Werkstoffe und Mechanik im Bauwesen,Technische Universit?t Darmstadt,Darmstadt,Germany |
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Abstract: | The delamination process of thin films on rigid substrates is investigated. Such systems are typically subject to high residual
compression and modest adhesion causing them to buckling driven blisters. In certain cases buckles with the shape of telephone
cords are observed. A finite element model for quasi–static delamination growth is developed. Applying a Reissner–Mindlin
shell kinematic for the film allows C
0− continuous shape functions. The traction vector at the film–substrate interface is obtained from the derivative of a cohesive
free energy. Incorporation of loading and unloading conditions is considered for the irreversible process. The equilibrium
state is computed iteratively in dependence of the compressive residual stresses. The computed telephone cord delaminations
are stable asymmetric configurations whereas the symmetric configurations are unstable. |
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Keywords: | Thin films Shell model Irreversible cohesive law Buckling Telephone cord delamination |
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