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| 高温高铅焊料无铅化的研究进展 | |
| 引用本文： | 曾秋莲,顾小龙,赵新兵,陈朝中,刘晓刚.高温高铅焊料无铅化的研究进展[J].电子元件与材料,2008,27(8). |
| 作者姓名： | 曾秋莲 顾小龙 赵新兵 陈朝中 刘晓刚 |
| 作者单位： | 1. 浙江省冶金研究院有限公司,浙江,杭州,310011;浙江大学,材料科学与工程学系,浙江,杭州,310027 2. 浙江省冶金研究院有限公司,浙江,杭州,310011;浙江省冶金研究院亚通电子有限公司,浙江,杭州,310021 3. 浙江大学,材料科学与工程学系,浙江,杭州,310027 4. 浙江省冶金研究院有限公司,浙江,杭州,310011 |
| 基金项目： | 浙江省2008年科技计划资助项目 |
| 摘 要： | 微电子封装工业中应用于高温领域的高铅焊料的无铅化是一个国际化难题。对目前高温无铅焊料的研究进展进行了综述,包括80Au-20Sn、Bi基合金、Sn-Sb基合金和Zn-Al基合金。从各种焊料的熔化行为、力学性能、导电导热性能、润湿性、界面反应和可靠性等方面,总结了这些高温无铅焊料的特性以及在应用中各自存在的问题。通过比较,认为Sn-Sb基合金在高温领域取代高铅焊料将有很大的应用前景。 |
| 关 键 词： | 电子技术 高温无铅焊料 综述 力学性能 界面反应 |
Progress of study on the lead-free of high temperature Pb-rich solder |
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| ZENG Qiu-lian,GU Xiao-long,ZHAO Xin-bing,CHEN Chao-zhong,LIU Xiao-gang.Progress of study on the lead-free of high temperature Pb-rich solder[J].Electronic Components & Materials,2008,27(8). | |
| Authors: | ZENG Qiu-lian GU Xiao-long ZHAO Xin-bing CHEN Chao-zhong LIU Xiao-gang |
| Affiliation: | ZENG Qiu-lian1,3,GU Xiao-long1,2,ZHAO Xin-bing3,CHEN Chao-zhong1,LIU Xiao-gang1 (1. Zhejiang Metallurgical Research Institute Co. Ltd.,Hangzhou 310011,China,2. Asia General Electronics Co. Ltd.,Zhejiang Metallurgical Research Institute,Hangzhou 310021,3. Department of Materials Science , Engineering,Zhejiang University,Hangzhou 310027,China) |
| Abstract: | The lead-free of the Pb-rich solder applied in high temperature region is a global difficulty in microelectronic packaging industry. The development of study on high temperature lead-free solders such as 80Au-20Sn, Bi-based alloys, Sn-Sb based alloys and Zn-Al based alloys was reviewed. Comprehensive properties of the solders were summarized in terms of melting behaviors, mechanical properties, conductivity and thermal conductivity, wetting behaviors, interface reactions and joint reliabilities, etc of such... |
| Keywords: | electron technology high temperature lead-free solder review mechanical properties interface reactions |
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