首页 | 本学科首页   官方微博 | 高级检索  
     

高温处理对3D C/SiC复合材料热膨胀性能的影响
引用本文:张青,成来飞,张立同,徐永东.高温处理对3D C/SiC复合材料热膨胀性能的影响[J].复合材料学报,2004,21(4):124-128.
作者姓名:张青  成来飞  张立同  徐永东
作者单位:西北工业大学 凝固技术国家重点实验室, 西安 710072
基金项目:国家自然科学基金,教育部跨世纪优秀人才培养计划,高等学校优秀青年教师教学科研奖励计划
摘    要:研究了不同高温处理前后3D C/SiC复合材料热膨胀系数(CTE)的变化规律,从材料内部热应力变化及结构改变的角度定性地分析了其变化机理。研究发现,3D C/SiC复合材料的热膨胀系数受界面热应力的影响,其变化规律是纤维和基体相互限制、相互竞争的结果;高温处理可提高材料的热稳定性,并通过改变界面热应力及材料内部结构,来影响材料热膨胀系数的变化规律;通过增加基体裂纹来降低复合材料的低温热膨胀,但不影响其变化规律;通过改变材料内部结构,使热应力发生变化并重新分布,对复合材料的高温热膨胀产生显著影响。但高温处理没有改变3D C/SiC复合材料的基体裂纹愈合温度(900℃)。 

关 键 词:碳纤维复合材料    热膨胀系数    高温处理    界面热应力
文章编号:1000-3851(2004)04-0124-05
收稿时间:2003-05-27
修稿时间:2003-08-05

EFFECTS OF HEAT TREATMENT ON THERMAL EXPANSION OF 3D C/SiC COMPOSITES
ZHANG Qing,CHENG Laifei,ZHANG Litong,XU Yongdong.EFFECTS OF HEAT TREATMENT ON THERMAL EXPANSION OF 3D C/SiC COMPOSITES[J].Acta Materiae Compositae Sinica,2004,21(4):124-128.
Authors:ZHANG Qing  CHENG Laifei  ZHANG Litong  XU Yongdong
Affiliation:State Key Laboratory of Solidification Processing,Northwestern Polytechnical University, Xi'an 710072,China
Abstract:3D C/SiC composites with PyC interlayer were fabricated by low pressure chemical vapor infiltration(LPCVI). The different expansion behavior of the composites was qualitatively analyzed before and after different heat treatments. The results show that the expansion behavior of 3D C/SiC composites, which was affected by interfacial thermal stress, can be regarded as the result of interaction of fibers and matrix. The thermal expansion behavior of the composites is changed after heat treatment due to the increase of thermal stability and the change of thermal stress and microstructure of the materials. The coefficient of thermal expansion (CTE) of the composites is decreased by the increase of matrix cracks at low temperatures and changed by the redistribution of thermal stress at high temperatures. However, the matrix cracks sealing temperature was not changed by heat treatment.
Keywords:C-fiber composite  coefficient of thermal expansion (CTE)  heat treatment  interfacial thermal stress
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《复合材料学报》浏览原始摘要信息
点击此处可从《复合材料学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号