| 微量铅对Sn9Zn钎料组织及微米压痕性能影响 |
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| 引用本文： | 吴敏,李金权.微量铅对Sn9Zn钎料组织及微米压痕性能影响[J].金属功能材料,2014(5):10-13. |
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| 作者姓名： | 吴敏 李金权 |
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| 作者单位： | 辽宁石油化工大学机械工程学院 |
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| 基金项目： | 辽宁省教育厅科学研究计划资助项目(2008382);辽宁石油化工大学科学基金(xjj-2013005) |
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| 摘 要： | 微量铅在目前的无铅工艺生产制造过程中广泛存在,并可对无铅钎料组织性能产生重要影响。运用X射线衍射仪、扫描电镜及其附属能谱仪、超微硬度测试仪等仪器设备,研究微量铅对Sn9Zn钎料组织及微米压痕性能影响。结果表明:不同含量的Pb能使Sn9Zn钎料组织得到细化;当Pb的质量分数达到0.8%时,相比Sn9Zn钎料,压痕深度相对下降12%,压痕硬度增大22%,达到0.31GPa,钎料蠕变性能得到改善。
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| 关 键 词： | 金属材料 铅 Sn9Zn钎料 组织 微米 微米压痕 |
Effect of Trace Amounts of Pb on Microstructure and Property of Microindentation of Sn9Zn Solder |
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| WU Min;LI Jin-quan.Effect of Trace Amounts of Pb on Microstructure and Property of Microindentation of Sn9Zn Solder[J].Metallic Functional Materials,2014(5):10-13. |
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| Authors: | WU Min;LI Jin-quan |
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| Affiliation: | WU Min;LI Jin-quan;School of Mechanical Engineering,Liaoning Shihua University; |
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| Abstract: | Trace amounts of Pb existing in widespread lead-free soldering processes currently,may impact on microstructure and property of lead free solder.Effect of trace amounts of Pb on microstructure and property of microindentation of Sn9 Zn solder was investigated by means of XRD、SEM and micro hardness tester etc.The results show that element Pb can make Sn9 Zn solder microstructure significantly refined at the different content of Pb;indentation displacement relative decline 12%,indentation hardness increased by 22%,reach to 0.31 GPa at Pb content（mass fraction）of 0.8%,and the solder creep performance is improved at same time. |
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| Keywords: | metal materials Pb Sn9Zn solder microstructure micrometer microindentation |
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