有机印制板上倒装芯片的可靠性研究

对一种有机印制板上倒装芯片（Ｆｌｉｐｃｈｉｐ）进行温度循环试验，测出其失效分布曲线，然后通过扫描声显微镜、红外显微镜和剖面等失效分析手段，发现失效模式主要是合金焊点中的断裂以及下部填充料（Ｕｎｄｅｒｆｉｌ）中的损伤如分层（Ｄｅｌａｍｉｎａｔｉｏｎ）和内部裂缝（Ｃｒａｃｋ）。详细地阐述了倒装芯片中的下部填充料损伤在温度循环试验条件下的产生、发展及它们对合金焊点可靠性的影响。

Reliability Study of a Flip Chip on Board Assembly

Thermal cycling test was performed on a flip chip on board (FCOB) assembly,and failure distribution in the test was measured.Using failure analysis tools such as scanning acoustic microscopy (SAM),infrared microscopy (IRM) and cross sectioning,the failure modes have been identified to be solder joint cracks as well as underfill damages such as delamination and cracks.In this study,we investigated initiation and development of damages in underfill in detail,and found the impact of these underfill related damages on reliability of solder joints.