The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages |
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| Authors: | M. T. Sheen C. M. Chang H. C. Teng J. H. Kuang K. C. Hsieh W. H. Cheng |
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| Affiliation: | (1) Institute of Electro-Optical Engineering, National Sun Yat-sen University, Kaohsiung, Taiwan;(2) Mechanical Engineering Department, National Sun Yat-sen University, Taiwan;(3) Institute of Material Science, National Sun Yat-sen University, Taiwan |
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| Abstract: | The joint strength and fracture surface of Pb/Sn and Au/Sn solders in laserdiode packages after thermal-aging testing were studied experimentally. Specimens were aged at 150°C for up to 49 days. The joint strength decreased as aging time increased. The microstructure and fracture surface of the Pb/Sn and Au/Sn solder joints showed that the joint strength decrease was caused by both the enlargement of the initial voids and an increase in the number of voids as aging time increased. The formation of Kirkendall voids with intermetallic-compound (IMC) growth of the Pn/Sn solder as aging time increased was also a possible mechanism for the joint-strength reduction. Finite-element method (FEM) simulations were performed on the joint-strength estimation of Pb/Sn and Au/Sn solders in thermal-aging tests. The coupled thermal-elasticity-plasticity model was used to simulate distributions of the thermal and residual stresses, creep deformation, and joint-strength variations in the solder joints under various thermal-aging tests. Simulation results were in good agreement with the experimental measurements that the solder-joint strength decreased as aging time increased. The result suggests that the FEM is an effective method for analyzing and predicting the solder-joint strength in laserdiode packages. |
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| Keywords: | Laser-diode packaging solder-joint strength thermal aging finite-element method |
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