| 电镀镍金工艺渗金原因分析及改善 |
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| 引用本文： | 黄李海.电镀镍金工艺渗金原因分析及改善[J].印制电路信息,2013(1):48-52. |
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| 作者姓名： | 黄李海 |
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| 作者单位： | 博敏电子股份有限公司 |
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| 摘 要： | 通过对采用贴干膜板进行电镀镍金工艺渗金造成批量报废的原因进行分析,采取多种试验方案寻找问题根源,使问题得到彻底解决。
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| 关 键 词： | 干膜 镀镍金 渗金 |
Reason analysis and improvement of infiltration gold in Nickel gold plating progress |
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| HUANG Li-hai.Reason analysis and improvement of infiltration gold in Nickel gold plating progress[J].Printed Circuit Information,2013(1):48-52. |
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| Authors: | HUANG Li-hai |
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| Affiliation: | HUANG Li-hai |
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| Abstract: | Based on batch scrap reason analysis of extraneous plating with dry film in Nickel gold plating progress and by adopting a variety of test scheme to find the root problem,we solved the problem thoroughly. |
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| Keywords: | Dry Film Nickel Gold Plating Infiltration Gold |
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