聚醚醚酮／低熔点金属合金复合材料的制备及性能

采用低熔点铜–磷(Cu-P)、铜–锡(Cu-Sn)合金与聚醚醚酮(PEEK)树脂通过真空热压烧结制得一种新型金属树脂复合材料，研究了PEEK含量对复合材料电性能及力学性能的影响，分析了材料复合界面及组织结构变化与性能变化的关系，测量并分析了材料电阻率与PEEK体积分数之间的关系。发现PEEK体积分数为15%时，复合材料的强度达到285 MPa，硬度为104.1 HRB，材料的导电性能和力学性能达到了综合最佳值，材料也形成了典型的海–岛相结构。

Preparation and Performance of Polyether Ether Ketone/Low Melting Point Metal Alloy Composites

By vacuum hotpressing,the low melting point metal alloy and polyether ether ketone (PEEK) resin were prepared into a new type of resin-metal binder. The effects of PEEK content on electrical and mechanical properties of composites were investigated,and the relationships between material interface and organization structure and the properties of materials were analyzed. The effect of PEEK volume fraction on electrical resistivity was also analyzed. When the resin volume content is 15%, the bending strength and hardness of the sample reachs 285 MPa and 104.1 HRB,and the conductive and mechanical properties of the sample reach the comprehensive optimum value,and the material also forms the perfect sea island phase structure.