Calculation of film stress from pitch measurements in LCD panel manufacturing

A method based on inverting a finite element model is presented for determining film stress from pitch changes before and after a film deposition step in liquid‐crystal display panel manufacturing. It differs from the conventional methods by making use of in‐plane deformation rather than out‐of‐plane measurements to calculate film stress. The resulting film stress is confounded with glass structural relaxation. Measurements of out‐of‐plane deformation at the edge of the sheet can be used with the pitch measurements to separate the effects of glass structural relaxation and film stress.