| 多层瓷介电容器失效模式和机理 |
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| 引用本文： | 刘欣,李萍,蔡伟.多层瓷介电容器失效模式和机理[J].电子元件与材料,2011,30(7):72-75,80. |
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| 作者姓名： | 刘欣 李萍 蔡伟 |
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| 作者单位： | 1. 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术重点试验室,广东广州,510610
2. 工业和信息化部电子第五研究所 可靠性研究分析中心,广东广州,510610 |
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| 摘 要： | 系统介绍了开路、短路和电参数漂移这三种主要的MLCC失效模式，以及介质层内空洞和电极结瘤、介质层分层、热应力和机械应力引起介质层裂纹、其他微观机理等五种主要的失效机理。针对MLCC的失效分析技术，从生产工艺和使用设计上提出了预防MLCC失效的措施。
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| 关 键 词： | 多层瓷介电容器 失效分析 综述 失效模式 失效机理 |
Failure model and mechanism of multilayer ceramic capacitor |
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| LIU Xin,LI Ping,CAI Wei.Failure model and mechanism of multilayer ceramic capacitor[J].Electronic Components & Materials,2011,30(7):72-75,80. |
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| Authors: | LIU Xin LI Ping CAI Wei |
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| Affiliation: | LIU Xin1,LI Ping1,CAI Wei2(1.Key Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component,the Fifth Research Institute of MIIT.Guangzhou 510610,China,2.Reliability Research and Analysis Center,the Fifth Research Institute of MIIT.,Guangzhou 510610,China) |
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| Abstract: | Three failure modes of multilayer ceramic capacitor(MLCC),such as open,short,key electrical parameters excursion,are systematically reported.The related failure mechanisms,including void,electrode nubble,delamination,and crack induced by thermal stress and machine stress,are also described.Finally,failure analysis technologies are discussed for MLCC,and some methods to avoid its failure from the viewpoint of design and produce process are suggested. |
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| Keywords: | multilayer ceramic capacitor failure analysis review failure model failure mechanism |
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