| BGA焊点的质量控制 |
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| 引用本文： | 鲜飞. BGA焊点的质量控制[J]. 印制电路信息, 2004, 0(10): 51-54,70 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,430074 |
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| 摘 要： | BGA是现代组装技术的新概念,它的出现促进SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。本文将结合实际工作中的一些体会和经验,就BGA焊点的接收标准、缺陷表现及可靠性等问题展开论述,特别对有争议的一种缺陷空洞进行较为详细透彻的分析,并提出一些改善BGA焊点质量的工艺改进的建议。
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| 关 键 词： | 表面贴装技术 球栅阵列封装 焊点 X射线 质量控制 |
Quality Control of BGA Solder Joint |
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| Xian Fei. Quality Control of BGA Solder Joint[J]. Printed Circuit Information, 2004, 0(10): 51-54,70 |
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| Authors: | Xian Fei |
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| Abstract: | BGA is a new concept of contemporary assembly technology. BGA has developed and innovated theSMT/SMD since it was appeared. It is believed that BGA will be the best choice of the IC with density, high perfor-mance, multiple function and high I/Os. The acceptable criterions, solder defects and reliability of BGA solder joint arediscussed here. Especially a disputed defect behave, void will be analyzed detailed. Some suggestions of improvingBGA solder joint quality will be also put forward. |
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| Keywords: | SMT BGA solder joint X-ray quality control |
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