| 环氧树脂导电胶的研究现状 |
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| 引用本文： | 李恩,虞鑫海,刘万章.环氧树脂导电胶的研究现状[J].化学与粘合,2012(5):60-62. |
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| 作者姓名： | 李恩 虞鑫海 刘万章 |
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| 作者单位： | 东华大学应用化学系;浙江金鹏化工股份有限公司 |
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| 摘 要： | 环氧导电胶是代替Sn/Pb焊料的一种胶黏剂,与传统的Sn/Pb焊料相比,环氧导电胶具有粘接温度低、可控性好、分辨率高、工艺简便以及环保等优点。近年来,科研工作者积极地研发高性能、多功能以及低成本的新型导电胶,以满足不断发展的市场需求。环氧导电胶作为一种新型的复合工业材料,具有巨大的发展潜力以及广阔的应用前景。阐述了影响环氧导电胶黏剂性能的因素以及高性能环氧导电胶的研究状况,并对环氧导电胶黏剂的未来发展作了展望。
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| 关 键 词： | 环氧导电胶黏剂 影响 性能 研究 |
The Research Situation of Epoxy Conductive Adhesive |
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| LI En,YU Xin-hai,and LIU Wan-zhang.The Research Situation of Epoxy Conductive Adhesive[J].Chemistry and Adhesion,2012(5):60-62. |
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| Authors: | LI En YU Xin-hai and LIU Wan-zhang |
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| Affiliation: | 1.Department of Applied Chemistry,Donghua University,Shanghai 201620,China;2.Zhejiang Golden Roc Chemical Co.,Ltd.,Taizhou 318050,China) |
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| Abstract: | The epoxy conductive adhesive is a substitute of Sn/Pb solder,compared to the traditional Sn/Pb solder,epoxy conductive adhesive has many advantages including low bonding temperature,good controllability,high resolution,simple technology and environmental friendly,etc.In recent years,the researchers have developed high-performance,multi-functional and low-cost novel conductive adhesive in order to meet the growing market demands.As a new industrial material,the epoxy conductive adhesive has great development potential and broad application prospects.The influencing factors on epoxy conductive adhesive and study situation of high-performance epoxy conductive adhesive are presented,and its future development is prospect. |
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| Keywords: | Epoxy conductive adhesive effect performance study |
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