| 铂电阻温度传感器封装结构影响响应时间的因素 |
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| 引用本文： | 周绍志,崔文德.铂电阻温度传感器封装结构影响响应时间的因素[J].导弹与航天运载技术,2009(3). |
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| 作者姓名： | 周绍志 崔文德 |
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| 作者单位： | 1. 北京航天发射技术研究所,北京,100076
2. 北京航天计量测试技术研究所,北京,100076 |
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| 摘 要： | 着重分析了铂电阻温度传感器在封装过程中影响响应时间的因素,提出了在封装过程中为缩短响应时间所应采取的措施.经验证表明,这些措施是有效的.
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| 关 键 词： | 温度传感器 响应时间 封装结构 |
Influences of the Packaging Structure of Platinum Resistance Temperature Sensor on Response Time |
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| Zhou Shaozhi,Cui Wende.Influences of the Packaging Structure of Platinum Resistance Temperature Sensor on Response Time[J].Missiles and Space Vehicles,2009(3). |
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| Authors: | Zhou Shaozhi Cui Wende |
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| Affiliation: | 1.Beijing Institute of Space Launch Technology;Beijing;100076;2.Beijing Institute of Space Measuring and Test Technology;100076 |
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| Abstract: | The influences on response time of the packaging structure of platinum resistance temperature sensor are analyzed,and some methods are advanced for shortening response time in the packaging process.It is proved that these methods are effective. |
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| Keywords: | Temperature sensor Response time Packaging structure |
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