| Abstract: | ![]()
This paper presents characterization and initial imaging results of a 32 x 32 element two-dimensional capacitive micromachined ultrasonic transducer array. The devices are fabricated using a wafer bonding process in which both the insulation layer and the membrane are user-deposited silicon nitride. The transducers use a row-column addressing scheme to simplify the fabrication process and beamformer. By adjusting the number of rows and columns that are biased, the effective aperture of the transducer can be adjusted. This is significant because it permits imaging in the near-field of the transducer without the use of a lens. The effect on the transmit beam profile is demonstrated. The transducer has a center frequency of 5.9 MHz and a relative bandwidth of 110%. Images of horizontal and vertical wires are taken to demonstrate image resolution. A three-dimensional image of four pin heads is also demonstrated. |
