光选择性活化无电解电镀在ABS树脂上沉积金属铜线路

在绝缘材料表面涂布活化催化膜，通过光选择性活化，然后在无电解电镀溶液中沉积金属电路是高密度封装和３－维ＭｌＤ关最理想的方法之一，，但目前所采用的光源多，使用波长均在３００ｎｍ以下，大规模实用有一定困难。本工作选择了３种Ｐｄ盐作为活性催化剂，研究使用紫外光１－线和ｇ－线在ＡＢＳ树脂上沉积铜线路的方法。实验结果表明，Ｐｄｌ２具有对紫外光敏感性，单独用作活化催化剂时可在ＡＢＳ上沉积负性金属铜图形，当它和

Photoselective Deposition of Copper Lines on ABS Substrates by Electroless Plating

Electroless plating combined with photoselective activation is an efficient technique for the selective metallization of dielectric substrates,which is a suitable candidate for high-density packaging and 3-dimensional MIDs (mould interconnection devices).Until now,most work in this area has emplolyed high power and costly laser systems,it is difficult to be used in industry.In recent years,it has been demonstrates that noble metals can be used to catalyze the initial plating of electroless solution.In this study we have chosen three species of palladium salts as photoselective catalytic and studied photolithography direct metal line deposition on ABS substrate using G-line or I-line.Thus,a negative copper pattern can be formed using PdI 2 alone and a positive copper pattern can be obtained using SnCl 2 and PdI 2 together on ABS substrate.