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| 降低电路板表面离子污染值的工艺研究 | |
| 引用本文： | 刘信安,陈双扣,高焕方,谢昭明,陈一农,郑国禹.降低电路板表面离子污染值的工艺研究[J].表面技术,2003,32(6):38-39,50. |
| 作者姓名： | 刘信安 陈双扣 高焕方 谢昭明 陈一农 郑国禹 |
| 作者单位： | 1. 重庆大学化学化工学院,重庆,400044 2. 中国兵器工业第五九研究所,重庆,400039 3. 总装重庆军代局驻五九所军代室,重庆,400039 |
| 摘 要： | 针对在线路板生产过程中，线路板表面的离子污染值(Ionic Contamination Value)较高，不能满足现代线路板生产的要求。研究了降低表面污染值的方法，通过试验对溶液组成、阳极组成及操作条件等工艺参数进行优化。并采用Omega Conductometer和X—ray能谱分析等方法对表面的变化情况进行测试和评价。结果表明，通过降低镀液中Pb^2 浓度，增加阳极中Sn的比率，并提高水洗温度后的工艺能满足实际生产的需要。 |
| 关 键 词： | 印制电路板 锡／铅电镀 电沉积 离子污染值 工艺研究 电迁移 线路板 |
| 文章编号： | 1001-3660(2003)06-0038-02 |
Improving Technique for Reducing Ionic Contamination on PCBs' Surface |
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| LIU Xin-an,CHEN Shuang-kou,GAO Huan-fang,XIE Zhao-ming,CHEN Yi-nong,ZHENG Guo-yu.Improving Technique for Reducing Ionic Contamination on PCBs'''' Surface[J].Surface Technology,2003,32(6):38-39,50. | |
| Authors: | LIU Xin-an CHEN Shuang-kou GAO Huan-fang XIE Zhao-ming CHEN Yi-nong ZHENG Guo-yu |
| Affiliation: | LIU Xin-an~1,CHEN Shuang-kou~1,GAO Huan-fang~2,XIE Zhao-ming~1,CHEN Yi-nong~3,ZHENG Guo-yu~3 |
| Abstract: | Owing to the Ionic Contamination (IC) Value on the PCB surface is often higher, it can't meet the requirements of modern PCB production. It is essential to study the feasible methods to reduce the IC value on PCB surface during some of the PCB process. By two measures taken and analysis the data recorded by X-ray instrument and Omega Conductometer, better operational parameter can be gained from the experiments. Experiment shows these parameters can meet the need of industrialization. |
| Keywords: | PCB Tin/Lead Plating Electronic deposition Ionic Contamination Electromigration |
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