| 材料表面化学镀铜及其应用 |
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| 引用本文： | 张万利,宣天鹏,汪亮,周赟.材料表面化学镀铜及其应用[J].电镀与环保,2011,31(4):1-4. |
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| 作者姓名： | 张万利 宣天鹏 汪亮 周赟 |
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| 作者单位： | 合肥工业大学材料科学与工程学院,安徽合肥,230009 |
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| 摘 要： | 化学镀铜作为优良的表面处理技术,在电子、机械、航空航天等工业中得到广泛应用.有关化学镀铜的机理及化学镀铜新工艺的研究是电子产品表面金属化研究的热点.介绍了化学镀铜的原理及其应用,指出了其所面临的主要问题和未来的主要研究方向.
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| 关 键 词： | 化学镀铜 表面金属化 机理 应用 |
Electroless Copper Plating on Material Surface and Its Applications |
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| ZHANG Wan-li,XUAN Tian-peng,WANG Liang,ZHOU Yun.Electroless Copper Plating on Material Surface and Its Applications[J].Electroplating & Pollution Control,2011,31(4):1-4. |
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| Authors: | ZHANG Wan-li XUAN Tian-peng WANG Liang ZHOU Yun |
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| Affiliation: | ZHANG Wan-li,XUAN Tian-peng,WANG Liang,ZHOU Yun(College of Material Science and Engineering,Hefei University of Technology,Hefei 230009,China) |
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| Abstract: | As a fine surface treatment technology,electroless copper-plating has been widely used in electronics,mechanical,aerospace industries,etc.The research on the mechanism and new processes of electroless copper-plating is a hot subject in surface metallization of electronic products.The mechanism and the applications of electroless copper-plating technique are described.Its main problems faced and future research directions are presented. |
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| Keywords: | electroless copper-plating surface metallization mechanism application |
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