Lowering curing temperature in adhesive bonding of aluminum AA6061-T4 |
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| Authors: | Yuan Li Sheng-nan Wang Yi-min Guo Zhong-Xia Liu Pei-Chung Wang |
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| Affiliation: | 1. Key Lab of Materials Physics, School of Physics and Engineering, Zhengzhou University, Zhengzhou, Henan, China;2. Manufacturing Systems Research Lab,General Motors Global Research and Development Center, Warren, MI, USA |
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| Abstract: | ABSTRACTTo minimize the part distortion and investment in the E-coat oven in adhesive bonding of metals for automotive applications, lowering the curing temperature of adhesive without apparent loss of the joint strength is desirable. The key to lower the curing temperature of adhesive bonding of lightweight materials is to accelerate the curing process of structural adhesives. In this study, curing agent (i.e., aliphatic polyamine) and curing accelerator (i.e., acetylacetone salt) were added into commercial Henkel 5089 adhesive and the effect of these curing additives on the curing temperature of Henkel 5089 in adhesive bonding of aluminum AA6061-T4 was studied. The test results showed that the addition of a curing agent and accelerator in Henkel 5089 lowered the curing temperature from 177°C to 130°C without sacrificing the strength of the adhesive-bonded aluminum AA6061-T4. |
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| Keywords: | Epoxy/epoxides automotive lap-shear cure/hardening aluminum and alloys |
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