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衬底温度对反应磁控溅射制备AlN压电薄膜的影响
引用本文:王忠良,刘桥.衬底温度对反应磁控溅射制备AlN压电薄膜的影响[J].电子元件与材料,2005,24(7):47-49.
作者姓名:王忠良  刘桥
作者单位:贵州大学,贵州,贵阳,550025;贵州大学,贵州,贵阳,550025
摘    要:采用反应磁控溅射法在Si(111)衬底上沉积了AlN薄膜。XRD分析表明,在5种温度下,AlN均以(100)面取向,衬底温度的提高有利于薄膜结晶性的改善,在600℃以上时AlN中Al—N0键断裂,仅出现(100)衍射峰。AFM分析显示,在600℃时平均晶粒尺寸90nm,Z轴最高突起仅为23nm。

关 键 词:无机非金属材料  AlN压电薄膜  反应磁控溅射  择优取向
文章编号:1001-2028(2005)07-0047-03

AlN Piezoelectric Thin Film Prepared by Reactive Magnetron Reactive Sputtering
WANG Zhong-liang,LIU Qiao.AlN Piezoelectric Thin Film Prepared by Reactive Magnetron Reactive Sputtering[J].Electronic Components & Materials,2005,24(7):47-49.
Authors:WANG Zhong-liang  LIU Qiao
Abstract:AlN thin films were successfully deposited on Si(111) substrates by reactive magnetron sputtering. XRD measurements detect AlN thin films with preferential orientations (100) at 5 different substrate temperature. The increase of substrate temperature will improve crystallizability. The Al—N0 bond will break and only detect (100) peak when substrate temperature is over 600℃. AFM observations of the films deposited at 600℃ reveal fine grains with size of 90 nm, topmost protuberance of 23 nm.
Keywords:inorganic non-metallic materials  AlN piezoelectric thin film  reactive magnetron sputtering  preferential  orientation  
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