聚变装置钨涂层面对等离子体材料的性能

对铜基体上真空等离子体喷涂1 mm的钨涂层进行了分析研究,主要包括微观结构、热力学属性以及成分分析.结果显示,钨涂层气孔率仅为7.6%,室温热导率达到79.7 W/(m·K),W/Cu结构界面结合强度高达45 MPa,这些结果对钨作为聚变装置面对等离子体材料的应用是令人鼓舞的.涂层材料的出气性能也是面对等离子材料的一个重要指标,钨涂层出气气体种类主要是氢气和水蒸气.而且在300℃经过4 h高温烘烤后出气率大幅度降低,更长时间的烘烤则对出气率影响不是太明显.因此可以看出钨涂层作为聚变装置面对等离子体材料的应用是可行的.

Characterization of Tungsten Coating Facing Material in Fusion Devices

The characterization of 1 mm W coating on copper alloys by means of vacuum plasma spraying technology was investigated, including microstructure, thermal properties, mechanical properties, and chemical composition. W coating MPa was obtained. These results are interesting for plasma spraying W coating used as plasma facing material. Besides, the gas desorption property of W coating was performed. H<,2> was the gas species with the largest desorption rate, then H2O. The gas desorption rate remarkably decreased after baking for 4 hours at 300℃, and it became not much changed after further baking. Therefore, it can be concluded that tungsten coating used as plasma facing material is feasible.