Production and characterization of high strength,thin-layered,pulp fiberboard using soy protein adhesives |
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| Authors: | Xin Li Donghai Wang Jo A. Ratto |
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| Affiliation: | 1. Department of Grain Science and Industry , Bio-materials and Technology Laboratory, Kansas State University , Manhattan , KS , 66506 , USA;2. Department of Biological &3. Agricultural Engineering , Kansas State University , Manhattan , KS , 66506 , USA;4. US Army Natick Research, Development and Engineering Center, Combat Feeding Directorate , Kansas Street, D112, Natick , MA , 01760 , USA |
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| Abstract: | Making thin-layered fiberboard and recycling the fiberboard materials are two major approaches to save quantities of wood fiber in fiberboard manufacture, which offer both environmental and economic benefits to the society and industry. The objective of this research was to develop high-strength, thin-layered pulp fiberboards (TLPBs) using sodium dodecyl sulfate (SDS)-modified soy protein adhesives for packaging applications. SDS-modified soy protein adhesives demonstrated significantly higher bonding strength than did unmodified soy protein adhesive. Results showed that the TLPB with SDS-modified soy flour adhesive (0.05?g/cm2 area density and 0.6?mm of thickness) had stronger tensile strength, similar burst index, and similar or better water soaking properties in comparison to commercial solid fiberboard (1.24?g/cm2 area density and 1.7?mm thickness). |
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| Keywords: | soy flour adhesive pulp mechanical properties dimensional stability |
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