| 多芯片阵列组合白光LED封装研究 |
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| 引用本文： | 黄春英,王晓军. 多芯片阵列组合白光LED封装研究[J]. 电子与封装, 2010, 10(2): 7-10 |
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| 作者姓名： | 黄春英 王晓军 |
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| 作者单位： | 广东技术师范学院机电学院,广州,510635;广东技术师范学院机电学院,广州,510635 |
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| 摘 要： | 文章阐述了LED器件的发光原理和芯片电极结构,围绕白光HB-LED的封装工艺,设计单个大功率芯片封装结构并对整个封装工艺进行研究,提出了多芯片阵列组合封装的创新理念,将其应用于多芯片阵列封装模块中。得出HB-LED封装中关键技术问题是提高外量子效率,采用高折射率硅胶减少折射率物理屏障带来的光子损失;采用高热导率的材料,减少由于封装工艺的缺陷带来的界面热阻。
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| 关 键 词： | 多芯片 白光LED 封装 |
Multi-chip Array Combination White Light LED Seal Research |
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| HUANG Chun-ying,WANG Xiao-jun. Multi-chip Array Combination White Light LED Seal Research[J]. Electronics & Packaging, 2010, 10(2): 7-10 |
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| Authors: | HUANG Chun-ying WANG Xiao-jun |
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| Affiliation: | Mechanical and Electronic Department of Guangdong Technology Normal College;Gangzhou 510635;China |
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| Abstract: | The illumination principle and the chip electrode structure of the LED component is elaborated. Researching on the design of seal structure of single high efficiency chip and the entire seal craft for the white light HB-LED seal craft, the innovation idea of the multi-chip array combination seal is proposed and used in the multi-chip array seal module. The key technology in the HB-LED seal is to enhance the quantum efficiency, use the silica gel with high refractive index to reduce the photon loss by the hi... |
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| Keywords: | multi-chips white light LED seal |
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