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Strain relaxation and dopant distribution in the rapid thermal annealing of Co with Si/Si1−xGex/Si heterostructure
Authors:Y Miron  M Efrati Fastow  C Cytermann  R Brener  M Eizenberg  M Glück  H Kibbel  U Knig
Affiliation:Y. Miron, M. Efrati Fastow, C. Cytermann, R. Brener, M. Eizenberg, M. Glück, H. Kibbel,U. König
Abstract:The reaction of cobalt with the Si-sacrificial cap in the strained Si/Si1−xGex/Si MBE grown heterostructure was studied. The Si-cap is added to prevent the relaxation of the SiGe and to guarantee uniform and reliable silicidation reaction. The Si1−xGex epilayer, with Ge content between 18 and 28 at%, was highly B doped, while the Si-cap was undoped or B doped either during growth or by ion implantation. Cobalt evaporation was followed by rapid thermal annealing at 450–700°C for 30 sec in N2 or Ar+10%H2. When the silicide penetrated the Si-cap/Si1−xGex interface, noticeable out-diffusion of Ge and B to the surface was observed. In spite of the presence of the Si-cap significant strain relaxation was observed in three cases: (1) in the implanted samples, although the implantation was confined to the Si-cap, (2) when the Co layer was too thick, such that the silicide penetrated the SiGe layer and (3) when the Ge content in the SiGe layer was relatively high (27.5%).
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