Assessment of electronics for cryogenic space exploration missions |
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| Affiliation: | 1. NASA Glenn Research Center, Electrophysics Branch, 21000 Brookpark Road, M.S. 301-5, Cleveland, OH 44135, United States;2. QSS Group, Inc., NASA Glenn Research Center, Cleveland, OH 44135, United States;3. University of Akron, Department of Electrical Engineering, Akron, OH 44325, United States;1. State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, PR China;2. University of Chinese Academy of Sciences, Beijing 100049, PR China;1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2. Shanghai Academy of Spaceflight Technology, Shanghai 201109, China |
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| Abstract: | Space exploration missions require electronics capable of efficient and reliable operation at low temperatures. Presently, spacecraft on-board electronics are maintained at approximately 20 °C through the use of radioisotopes. Cryogenic electronics would enhance efficiency of space systems, improve reliability, and simplify their design. A Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for space exploration missions. The effects of cryogenic temperature and thermal cycling are being investigated for commercial-off-the-shelf components as well as for components specially developed for low temperature operation. An overview of this program along with selected experimental data is presented in this paper. |
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