| 大功率LED封装的热管理 |
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| 引用本文： | 程骞.大功率LED封装的热管理[J].电子工艺技术,2007,28(6):311-315. |
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| 作者姓名： | 程骞 |
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| 作者单位： | 哈尔滨工业大学(威海),山东,威海,264209 |
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| 摘 要： | 建立了一种大功率LED照明灯具的实际封装结构,采用ANSYS有限元软件对其进行热分析,得出了其稳态的温度场分布,并通过实际测量与计算得出了原始模型LED的实际节温,在此基础上提出了几种优化方案,分别采用不同的LED封装材料以及不同的铝热沉结构尺寸,并且进行了模拟对比,对其中一种可行性方案进行了参数优化,在经济和效果之间达到了较好的平衡,获得了较好的优化效果.
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| 关 键 词： | 大功率LED 优化 热管理 |
| 文章编号： | 1001-3474（2007）06-0311-05 |
| 收稿时间： | 2007-08-14 |
| 修稿时间： | 2007年8月14日 |
Thermal Management of High- power White LED Package |
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| CHENG Qian.Thermal Management of High- power White LED Package[J].Electronics Process Technology,2007,28(6):311-315. |
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| Authors: | CHENG Qian |
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| Abstract: | A novel package and thermal analysis based on ANSYS software for high - power white LED were presented. An actual structural model of LED was constructed, and through simulation with ANSYS, the steady - state temperature fields of LED were obtained. Several optimization designs of different substrate materials and different Al heat - sink sizes of LED were put forward, and their simulation results were compared. When only Al heat- sink is used, the optimization design with the least consumption of Al and that approach of it are feasible, because they can achieve both benefit and effectiveness. |
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| Keywords: | ANSYS |
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