| 电化学迁移与耐CAF基材 |
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| 引用本文： | 张良静,刘晓阳.电化学迁移与耐CAF基材[J].印制电路信息,2007(11):20-21,66. |
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| 作者姓名： | 张良静 刘晓阳 |
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| 作者单位： | 江南计算技术研究所,江苏无锡,214083 |
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| 摘 要： | 文章阐述了电化学迁移对印制电路板绝缘性的破坏,并分析了CAF现象的成因和影响因素,介绍了改善基材耐CAF性能的方法。
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| 关 键 词： | 电化学迁移 导电阳极丝 无铅 耐CAF基材 |
| 文章编号： | 1009-0096(2007)11-0020-02 |
Electrochemical Migration and Anti-CAF Laminates |
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| Zhang Liangjing,Liu Xiaoyang.Electrochemical Migration and Anti-CAF Laminates[J].Printed Circuit Information,2007(11):20-21,66. |
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| Authors: | Zhang Liangjing Liu Xiaoyang |
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| Affiliation: | Zhang Liangjing Liu Xiaoyang |
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| Abstract: | In this paper, the insulation failure of Printed Circuit Boards has been summarized due to electrochemical migration, and the mechanism and effect parameters of CAF was analyzed, and then some anti-CAF laminates were introduced. |
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| Keywords: | electrochemical migration conductive anodic filament lead-free Anti-CAF laminates |
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