两种热电分离式MCPCB导热性能的对比研究

利用SMT工艺将两种功率不同的LED分别与设计完全相同的热电分离式铜基板及铝基板组装成模组,然后借助结温测试系统及积分球系统对两种金属基板的散热性能进行了对比研究。结果表明,热电分离式铜基板较之热电分离式铝基板仅具备微弱的散热优势,这种优势随着LED的功率增加有所扩大。当LED功率为9 W时,铜基板及铝基板所对应的LED模组热阻分别是3.16℃/W、3.26℃/W;当LED功率为15 W时,铜基板及铝基板所对应的LED模组热阻分别是2.33℃/W、2.46℃/W。

Comparative Study on Heat Dissipation Performances of Two Types of Metal Core Printed Circuit Board Featuring Electrically-Neutral-Thermal-Path

Two types of LEDs with different powers were respectively mounted on electrically-neutral-thermal-path MCPCB,namely copper based and aluminum based MCPCB to prepare LED modules employing SMT technology. Subsequently,a comparison of heat dissipation performances between the aforementioned MCPCBs based on thermal resistances of LED modules was conducted via junction tester system integrating sphere system. It was found that the copper based MCPCB merely presented weak heat dissipation edge in comparison with aluminum based counterpart,and this edge was widened as the power of LED increased. When LED is 9 W,the thermal resistances of LED modules corresponding to copper based MCPCB and aluminum based MCPCB were 3.16 ℃/W and 3.26 ℃/W respectively. When LED is 15 W,the thermal resistances of LED modules corresponding to copper based MCPCB and aluminum based MCPCB were 2.33 ℃/W and 2.46 ℃/W respectively.