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Low temperature synthesis of silver-palladium alloy powders internal electrodes for multilayer ceramic devices
Authors:R. Ueyama  K. Kamada  M. Harada  T. Ueyama  T. Yamamoto  K. Kuribayashi  K. Koumoto  T. Shiosaki
Affiliation:(1) Daiken Chemical Industry Corporation Limited, 2-7-19 Hanaten-nishi, Jyto-ku, Osaka, 536-0011, Japan;(2) Department of Electrical Engineering, National Defense Academy, 1-10-20 Hasirimizu, Yokosuka, 239-0811, Japan;(3) Department of Materials, Teikyo University of Science and Technology, 2525 Yatsuzawa, Uenohara-Machi, Yamanashi, 409-0193, Japan;(4) Department of Applied Chemistry, Nagoya University, furou-cho Chikusa-ku, Nagoya, 464-8603, Japan;(5) Nara Institute of Science and Technology, t8916-5 Takayama-Cho, Ikoma, 630-0101, Japan
Abstract:Physical and electrical properties of three types of Ag-Pd pastes, which consist of different metal fine powders, i.e., a coprecipitated powder, an agglomerated alloy powder made by heat treatment and a pulverized alloy powder produced by improved pulverization method, have been studied. The paste prepared from pulverized alloy powder showed a higher film packing density (6.3 g/cm3) than those made of the other powders. The film consisting of pulverized alloy powder showed a lower expansion at around 500 °C, a lower shrinkage from 700 °C to 1100 °C and a lower electric resistivity. The results indicated that the paste which consists of an pulverized Ag-Pd alloy powder was superior in performance to the other two pastes for an internal electrode material of multilayer ceramic device.
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