| Sn-8Zn-3Bi无铅焊料的表面改性 |
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| 引用本文： | 谭木娣,尚红霞,陈坤. Sn-8Zn-3Bi无铅焊料的表面改性[J]. 电子元件与材料, 2008, 27(2): 45-47 |
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| 作者姓名： | 谭木娣 尚红霞 陈坤 |
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| 作者单位： | 广东工业大学,轻工化工学院,广东,广州,510006 |
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| 摘 要： | 采用液相法用有机物改性剂对Sn-8Zn-3Bi焊料进行表面包覆改性,以改善焊料的润湿性能及抗氧化性能。对包覆样品进行了红外光谱表征。考察了样品的抗氧化性、润湿性能和存储性能。结果表明:采用液相法可以实现在Sn-8Zn-3Bi焊料表面包覆有机物。以有机物C为改性剂,且用量为2%(质量分数)时得到的改性样品的润湿角θ为7.8°,铺展面积S为108.83mm2,而未被改性的焊料θ为10.74°,S为93.40mm2。
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| 关 键 词： | 电子技术 Sn-8Zn-3Bi焊料 改性 抗氧化性 润湿性 |
| 文章编号： | 1001-2028（2008）02-0045-03 |
| 收稿时间： | 2007-10-09 |
| 修稿时间： | 2007-10-09 |
Surface coating modification of Sn-8Zn-3Bi lead-free solder |
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| TAN Mu-di,SHANG Hong-xia,CHEN Kun. Surface coating modification of Sn-8Zn-3Bi lead-free solder[J]. Electronic Components & Materials, 2008, 27(2): 45-47 |
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| Authors: | TAN Mu-di SHANG Hong-xia CHEN Kun |
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| Affiliation: | TAN Mu-di,SHANG Hong-xia,CHEN Kun (School of Chemical Engineering , Light Industry,Guangdong University of Technology,Guangzhou 510006,China) |
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| Abstract: | Liquid phase method was used to coat the organic modifiers on the surface of Sn-8Zn-3Bi lead-free solder powder. The coated sample was characterized by IR and its behaviors of antioxidation and wettability were investigated. The results indicate that the coated sample greatly excels the un-coated Sn-8Zn-3Bi lead-free solder powder in the antioxidation and wettability. Organic compound C-coated 2% (mass fraction) sample, wetting angle θ is 7.8° and spreading area S is 108.83 mm2,but un-coated sample’s wetting angle and spreading area are 10.74° and 93.40 mm2, respectively. |
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| Keywords: | electron technology Sn-SZn-3Bi solder modification antioxidation wettability |
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