A new chip-thickness model for performance assessment of silicon carbide grinding

The chip-thickness models, used to assess the performance of grinding processes, play a major role in predicting the surface quality. In the present paper, an attempt has been made to develop a new chip-thickness model for the performance assessment of silicon carbide grinding by incorporating the modulus of elasticities of the grinding wheel and the workpiece in the existing basic chip-thickness model to account for elastic deformation. The new model has been validated by conducting experiments, taking the surface roughness as a parameter of evaluation .