| 多层陶瓷电容器的失效分析 |
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| 引用本文： | 刘燕芳,郭海波,潘启智,王治平.多层陶瓷电容器的失效分析[J].电子元件与材料,2010,29(11). |
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| 作者姓名： | 刘燕芳 郭海波 潘启智 王治平 |
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| 作者单位： | 中达电子(江苏)有限公司物性失效分析实验室; |
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| 摘 要： | 采用外观观察和金相分析方法,对绝缘电阻偏低的多层陶瓷电容器(MLCC,简称为C1)、以及无容值且端电极短路的MLCC(简称为C2),进行了失效原因分析,研究了这两种MLCC的失效机理。结果表明:C1的失效是因电路板过度弯曲使电容器受到过大的机械应力,以致C1内部产生裂纹;C2的失效是因额定电压为500 V,耐压不足而致电压击穿,产生瞬间高压裂纹。生产过程中避免电路板弯曲及选用匹配的电容器,可有效降低MLCC的失效率。
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| 关 键 词： | 多层陶瓷电容器 失效分析 裂纹 金相分析 |
Failure analysis of multi-layer ceramic capacitor |
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| LIU Yanfang,GUO Haibo,PAN Qizhi,WANG Zhiping.Failure analysis of multi-layer ceramic capacitor[J].Electronic Components & Materials,2010,29(11). |
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| Authors: | LIU Yanfang GUO Haibo PAN Qizhi WANG Zhiping |
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| Affiliation: | LIU Yanfang,GUO Haibo,PAN Qizhi,WANG Zhiping(Physical Failure Analysis Lab,Delta Electronics(Jiangsu) Co.,Ltd,Suzhou 215200,Jiangsu Province,China) |
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| Abstract: | The failure reasons of multi-layer ceramic capacitor(MLCC) with lower insulation resistance(C1 for short) and MLCC with no capacitance and short circuit between terminal electrodes(C2 for short) were analyzed by means of visual inspection and metallographic analysis,and the failure mechanisms of the two MLCCs were also studied in detail.The results show that the failure of C1 is due to the occurrence of internal mechanical stress crack as a result of the excessive mechanical stresses generated with the over... |
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| Keywords: | MLCC failure analysis crack metallographic analysis |
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