Thermal properties of Sn-based solder alloys

During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element. This situation drives to the replacement of the Sn–Pb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary Sn–Ag, Sn–Cu, Sn–Bi, Sn–Zn, Sn–Pb and ternary Sn–Ag–Cu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.