| CBGA组件热变形的2D-Plane42模型有限元分析 |
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| 引用本文： | 杨玉萍,耿照新.CBGA组件热变形的2D-Plane42模型有限元分析[J].微电子技术,2003,31(6):63-65,54. |
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| 作者姓名： | 杨玉萍 耿照新 |
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| 作者单位： | 1. 中国科学院物理所,北京,100008
2. 首都师范大学物理系,北京,100037 |
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| 摘 要： | 本文介绍有限元中的2D-Plane42模型在CBGA组件热变形中的应用，利用有限元的模拟CBGA组件的应变、应力的分布，通过模拟表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法。
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| 关 键 词： | CBGA组件 热变形 应变 应力 有限元分析 2D-Plane42模型 微电子封装 |
| 文章编号： | 1008-0147(2003)06-63-03 |
2-D PLANE42 Model of Finite Element Simulation Analysis of Thermal Deformation in CBGA Assembly |
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| YANG Yu-ping ,GENG Zhao-xin.2-D PLANE42 Model of Finite Element Simulation Analysis of Thermal Deformation in CBGA Assembly[J].Microelectronic Technology,2003,31(6):63-65,54. |
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| Authors: | YANG Yu-ping GENG Zhao-xin |
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| Affiliation: | YANG Yu-ping 1,GENG Zhao-xin 2 |
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| Abstract: | In this paper, 2-D PLANE42 model of finite element simulation analysis applied in thermal deformation of ceramic ball grid array (CBGA) assembly is presented. The finite element method is used to simulate distribution of strain and stress of CBGA, the simulation indicates the finite element simulation analysis is a method in studying reliability of the solder joint for ball grid array (BGA) and the CBGA assembly in packaging of microelectronics. |
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| Keywords: | CBGA Thermal deformation Strain Stress Finite element analysis |
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