Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder |
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| Authors: | Qian Zhang Abhijit Dasgupta Peter Haswell |
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| Affiliation: | (1) CALCE Electronic Products and Systems Center, Mechanical Engineering Department, University of Maryland, 20742 College Park, MD;(2) Present address: Dell Inc., 78681 Round Rock, TX;(3) Present address: Hamilton Sundstrand Corp., 06096-1010 Windsor Locks, CT |
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| Abstract: | The partitioned viscoplastic-constitutive properties of the Sn3.9Ag0.6Cu Pb-free alloy are presented and compared with baseline
data from the eutectic Sn63Pb37 solder. Steady-state creep models are obtained from creep and monotonic tests at three different
temperatures for both solders. Based on steady-state creep results and creep-test data, a transient creep model is developed
for both Pb-free and Sb37Pb solders. A one-dimensional (1-D), incremental analytic model of the test setup is developed to
simulate constant-load creep and monotonic and isothermal cyclic-mechanical tests performed over various temperatures and
strain rates and stresses using a thermome-chanical-microscale (TMM) test system developed by the authors. By fitting simulation
results to monotonic testing data, plastic models are also achieved. The comparison between the two solders shows that Sn3.9Ag0.6Cu
has much better creep resistance than Sn37Pb at low and medium stresses. The obtained, partitioned viscoplastic-constitutive
properties of the Sn3.9Ag0.6Cu Pb-free alloy can be used in commercial finite-element model software. |
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| Keywords: | Pb-free solder creep plastic constitutive property viscoplastic |
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