| 埋入式BGA焊点可靠性和信号完整性优化 |
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| 引用本文： | 路良坤,黄春跃,黄根信,梁颖,李天明.埋入式BGA焊点可靠性和信号完整性优化[J].焊接学报,2019,40(2):116-122. |
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| 作者姓名： | 路良坤 黄春跃 黄根信 梁颖 李天明 |
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| 作者单位： | 桂林电子科技大学 机电工程学院,桂林,541004;成都航空职业技术学院 电子工程系,成都,610021;桂林航天工业学院 汽车与动力工程系,桂林,541004 |
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| 基金项目： | 国家自然科学基金项目(51465012)；军委装备发展部“十三五”装备预研领域基金项目；四川省科技技术资助项目(2018JY0292)；广西研究生教育创新计划项目(YCSW2018136) |
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| 摘 要： | 建立了埋入式微尺度球栅阵列(ball grid array, BGA)焊点有限元分析模型和三维电磁仿真模型，分别进行热循环加载分析和信号完整性分析. 选取焊点最大径向尺寸、焊点高度和焊盘直径作为设计变量，以焊点的热疲劳寿命和回波损耗最小为目标，利用正交试验和灰色关联分析相结合的方法对BGA焊点进行多目标优化设计，并通过试验对信号完整性优化结果进行了验证. 结果表明，优化后焊点最大等效应力下降了8.2%，在热疲劳寿命提高了2.15倍的同时回波损耗降低了11.8%，信号完整性试验验证了优化结果的有效性.
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| 关 键 词： | 球栅阵列 正交试验 灰色关联 可靠性 信号完整性 |
| 收稿时间： | 2017/12/25 0:00:00 |
Optimal design of reliability and signal integrity for embedded micro-scale BGA solder joint |
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| LU Liangkun,HUANG Chunyue,HUANG Genxin,LIANG Ying,LI Tianming.Optimal design of reliability and signal integrity for embedded micro-scale BGA solder joint[J].Transactions of The China Welding Institution,2019,40(2):116-122. |
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| Authors: | LU Liangkun HUANG Chunyue HUANG Genxin LIANG Ying LI Tianming |
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| Affiliation: | 1. School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China;2. Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China;3. Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China |
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| Abstract: | A finite element analysis model of ball grid array(BGA) solder joints and a three-dimensional electromagnetic simulation model were established, respectively. The radial dimension, the height and the pad diameter of the solder joint were selected as design variables. The thermal fatigue life and the return loss of the solder joint were selected as the target. The multi-objective optimization design of BGA solder joints was carried out by the combination of experiments and grey correlation analysis. The signal integrity optimization results were verified by experiment. The results show that: after optimization the maximum equivalent stress of solder joints was decreased by 8.2%. The return loss decreased by 11.8% and fatigue life increased 2.15 times. The signal integrity experiment verified the effectiveness of the optimization results. |
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| Keywords: | BGA solder joint|orthogonal experiment|grey relational analysis|reliability|signal integrity |
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