废旧印刷电路板剪切式粉碎的试验研究

为实现废旧电路板的资源化利用,采用剪切式粉碎与球磨粉碎方式对电路板进行细碎的研究。结果表明:根据电路板层间剪切强度比较小的特点,采用剪切式粉碎方法可以有效对其进行粉碎并解离,并随着粉碎粒度的减小,各组分大小越均匀,解离越完全;与剪切粉碎效果相比,球磨粉碎易使电路板材料变薄,成片状薄板状,但不易被粉碎,粉碎的细度与均匀性不如剪切粉碎。

Study on Preparing Ultrafine Particles of Waste Printed Circuit Boards by Shear Milling

In order to achieve the reutilization of waste printed circuit boards,the experiments of preparing ultrafine particles of waste printed circuit boards were conducted by shear milling and ball milling.The results showed that the printed circuit boards were crushed and liberated effectively by shear milling because of its smaller interlaminar shear strength.Along with the reduction of crushed particle size,the size of each component became more uniform,and dissociation became more complete.Compared to the effect of shear milling,the printed circuit boards were became thin flakes easily by ball milling,but they were crushed difficultly.The fineness and uniformity of ultrafine particles of waste printed circuit boards prepared by shear milling were better than those of prepared by ball milling.