Colloidal Cu nanoparticles/chitosan composite film obtained by microwave heating for food package applications |
| |
| Authors: | G Cárdenas J Díaz V M F Meléndrez C Cruzat C A García Cancino |
| |
| Affiliation: | (1) CIPA-Chile, Department of Polymers, Advanced Materials Laboratory, University of Concepcion, Casilla, 160, Chile;(2) Department of Microbiology, Faculty of Biology, University of Concepcion, Casilla, 160, Chile |
| |
| Abstract: | In this paper, we describe the preparation and characterization of colloidal Cu nanoparticles/chitosan composite film (composite
film) by solution-casting technique with microwave heating. Effects of the incorporation of colloidal Cu nanoparticles on
structure, thermal behavior, surface, barrier properties and light transmission of composite film were investigated. The antimicrobial
activity of films against Staphylococcus aureus and Salmonella enterica serovar Typhimurium, were also tested. Incorporation of colloidal Cu nanoparticles on chitosan matrix improved the barrier
properties of films, decreasing the oxygen permeability as well as water vapor permeability and increasing the protection
against UV light. The composite film was effective in alteration of cell wall and reduction of microbial concentration in
the liquid culture for both bacteria tested. |
| |
| Keywords: | Colloidal Cu nanoparticles Chitosan Microwave heating Films Light barrier Water barrier Antimicrobial activity |
| 本文献已被 SpringerLink 等数据库收录！ |
|
