N,N?二甲基?二硫代甲酰胺丙磺酸钠对THPED体系化学镀铜的影响

研究了N,N?二甲基?二硫代甲酰胺丙磺酸钠(DPS)作为添加剂对以四羟丙基乙二胺(THPED)为单一配位剂的化学镀铜体系的沉积速率、镀层形貌和晶体结构的影响。结果发现,当DPS的质量浓度从0 mg/L增大到1.0 mg/L时,沉积速率从2.91μm/h提高到6.73μm/h,所得镀层结晶均匀、细致。线性扫描伏安测量结果表明,DPS是通过促进甲醛的阳极氧化来加速化学镀过程。本体系的Cu镀层主要呈面心立方多晶取向,DPS的添加会令晶面取向从(220)转变为(111)。

Effect of sodium N,N-dimethyl-dithiocarbamyl-propanesulfonate on electroless copper plating in tetrahydroxypropyl ethylenediamine bath

The effect of N,N-dimethyl-dithiocarbamyl-propanesulfonate(DPS)as an additive on the deposition rate,morphology,and crystal structure of copper coating plated electrolessly from a bath with tetrahydroxypropyl ethylenediamine(THPED)as a complexant was studied.The results showed that the deposition rate was increased from 2.91μm/h to 6.73μm/h when the mass concentration of DPS in the bath was increased from 0 mg/L to 1.0 mg/L,and the crystal structure of copper coating became more uniform,finer,and more compact.The linear sweep voltammetric results showed that DPS could accelerate the electroless plating process by promoting the anodic oxidation of formaldehyde.The Cu coatings obtained from the bath were primarily face-centered cubic polycrystalline,and their orientation would transferred form(220)to(111)after the addition of DPS.