| 以计时电位法优化盲孔电镀添加剂的配方 |
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| 引用本文： | 邓智博,陈际达,陈世金,张秀梅,杨凯,张柔,郭茂桂,廖金超.以计时电位法优化盲孔电镀添加剂的配方[J].电镀与涂饰,2021,40(3):177-182. |
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| 作者姓名： | 邓智博 陈际达 陈世金 张秀梅 杨凯 张柔 郭茂桂 廖金超 |
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| 作者单位： | 重庆大学化学化工学院,重庆 401331;重庆大学化学化工学院,重庆 401331;博敏电子股份有限公司,广东 梅州 514000;电子科技大学材料与能源学院,四川 成都 610054;重庆大学化学化工学院,重庆 401331;重庆大学化学化工学院,重庆 401331;博敏电子股份有限公司,广东 梅州 514000;博敏电子股份有限公司,广东 梅州 514000 |
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| 基金项目： | 国家自然科学基金;广东省"扬帆计划"先进印制电路关键技术研发及产业化项目 |
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| 摘 要： | 采用220 g/L CuSO4·5H2O+0.54 mol/L H2SO4作为酸性电镀铜填盲孔的基础镀液,加入Cl-、二丙烷二磺酸钠(SPS)、聚乙二醇(PEG10000)、吡咯烷二硫代氨基甲酸铵盐(APTDC)作为添加剂,以计时电位法研究了镀铜铂盘电极在100 r/min和1 000 r/min转速下,这4种添加剂的质量浓度对阴极电位的影响,并记录不同对流强度下的电位差。得到优化的添加剂组合为:Cl--50 mg/L,PEG10000 150 mg/L,SPS 2.5 mg/L,APTDC 2.5 mg/L。采用此配方对盲孔进行电镀,填孔率在90%以上,平均面铜厚度为15.4μm,镀层光滑平整,抗热冲击性能好。
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| 关 键 词： | 盲孔 电镀铜 填孔 计时电位法 阴极电位 厚度 |
Optimization on combination of additives for blind via electroplating by chronopotentiometry |
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| DENG Zhibo,CHEN Jida,CHEN Shijin,ZHANG Xiumei,YANG Kai,ZHANG Rou,GUO Maogui,LIAO Jinchao.Optimization on combination of additives for blind via electroplating by chronopotentiometry[J].Electroplating & Finishing,2021,40(3):177-182. |
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| Authors: | DENG Zhibo CHEN Jida CHEN Shijin ZHANG Xiumei YANG Kai ZHANG Rou GUO Maogui LIAO Jinchao |
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| Affiliation: | (School of Chemistry and Chemical Engineering,Chongqing University,Chongqing 401331,China;Bomin Electronics Ltd.,Meizhou 514000,China;State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China) |
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| Abstract: | Chloride ion,3,3’-dithiodipropane sulfonate(SPS),polyethylene glycol(PEG 10000),and ammonium pyrrolidine-1-carbodithioate(APTDC)were used as additives for blind via filling in an acidic bath comprising 220 g/L CuSO4·5H2O and 0.54 mol/L H2SO4.The effects of the mass concentrations of the four said additives on the cathodic potential at a rotational speed of 100 r/min or 1000 r/min was studied by chronopotentiometry with a copper-plated platinum disc electrode.The potential difference at different convection intensities was recorded.The additive formulation was optimized as follows:Cl-50 mg/L,PEG10000150 mg/L,SPS 2.5 mg/L,and APTDC 2.5 mg/L.The blind via filling effectiveness was over 90%therewith.The copper coating electrodeposited at the surface was 15.4μm in thickness,smooth,uniform,and well resistant to thermal shock. |
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| Keywords: | blind via copper electroplating filling chronopotentiometry cathodic potential thickness |
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