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Roles and mechanistic analysis of adenine as a green inhibitor in chemical mechanical polishing |
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| Authors: | Zeng Nengyuan Zhao Hongdong Luo Chong Liu Yuling Wang Chenwei Ma Tengda Wang Wantang |
| Affiliation: | 1.School of Electronics and Information Engineering, Hebei University of Technology, Tianjin, 300130, People’s Republic of China ;2.Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin, 300130, People’s Republic of China ; |
| Abstract: | Journal of Applied Electrochemistry - In the process of multilayer copper wiring CMP (chemical mechanical polishing), electrochemical corrosion will occur due to the contact between slurries and... |
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