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Study of the hinge thickness deviation for a 316L parallelogram flexure mechanism fabricated via selective laser melting
Authors:Wei  Huaxian  Shirinzadeh  Bijan  Niu  Xiaodong  Zhang  Jian  Li  Wei  Simeone  Alessandro
Affiliation:1.Department of Mechanical Engineering, College of Engineering, Shantou University, Shantou, 515063, China
;2.Key Laboratory of Intelligent Manufacturing (Shantou University), Ministry of Education of China, Shantou, 515063, China
;3.Robotics and Mechatronics Research Laboratory, Department of Mechanical and Aerospace Engineering, Monash University, Melbourne, VIC, 3800, Australia
;4.School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou, 221116, China
;
Abstract:

3D printing offers great potential for developing complex flexure mechanisms. Recently, thickness-correction factors (TCFs) were introduced to correct the thickness and stiffness deviations of powder-based metal 3D printed flexure hinges during design and analysis. However, the reasons for the different TCFs obtained in each study are not clear, resulting in a limited value of these TCFs for future design and fabrication. Herein, the influence of the porous layer of 3D printed flexure hinges on the hinge thickness is investigated. Samples of parallelogram flexure mechanisms (PFMs) were 3D printed using selective laser melting (SLM) and 316L stainless steel powder. A 3D manufacturing error analysis was completed for each PFM sample via 3D scanning, surface roughness measurement and morphological observation. The thickness of the porous layer of the flexure hinge was independent of the designed hinge thickness and remained close to the average powder particle diameter. The effective hinge thickness could be estimated by subtracting twice the value of the porous layer thickness from the designed value. Guidelines based on finite element analysis and stiffness experiments are proposed. The limitations of the presented method for evaluating the effective hinge thickness of flexure hinges 3D printed via SLM are also discussed.

Keywords:
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